Tools
KGX-602 Reballing Paste is a high-quality lead-free solder paste specifically designed for BGA reballing, chip rework, and precision PCB repair. It features a low melting temperature of approximately 138 °C, making it ideal for delicate surface-mount applications such as mobile phone, tablet, and electronic motherboard repairs.
This solder paste combines a finely formulated solder alloy with active flux, delivering excellent wetting performance and reliable solder joints during reflow. Its tacky paste consistency ensures secure placement of solder balls and components before heating, which helps reduce bridging and improves reflow outcomes.
SILVER –
It’s better than the usual mechanic ones like the 183° or the usual trash 138°, it’s better then those two it’s the 199° rebaling paste which defines it’s durability in comparison to those two or others in the surrounding market!
Highly recommend for professionals!